Title: Mass production method for the manufacture of surface mount solid state capacitor and resulting capacitor
Application Number: 93117327 Application Date: 1993.09.24
Publication Number: 1085345 Publication Date: 1994.04.13
Approval Pub. Date: 1995.11.22 Granted Pub. Date: 1995.11.22
International Classifi-cation: H01G9/00;H01G13/00
Applicant(s) Name: AVX Corporation Address:
Inventor(s) Name: Ian Salisbury
Attorney & Agent: WANG YIPING
Abstract:
    A method of simultaneously forming a multiplicity of surface mountable solid state capacitors is disclosed. The method comprises mounting on a substrate a wafer of powdered solid state capacitor forming metal, sintering the wafer and metal together to fuse the interface between wafer and substrate to each other and convert the wafer into a porous integral mass, dividing the sintered wafer into a multiplicity of mutually spaced sub-units, isolating the interface or boundary between the substrate and sub-units one from the other by a resin infusion or by a dielectric deposition step, causing the sub-units to be converted to capacitors by sequential anodizing and manganizing steps, bonding a cathode plate to the counter electrode components present on the upper surfaces of the sub-units in electrical contact therewith, filling with insulative resin material by injecting between the plates utilizing the plates as elements of a mold, and after hardening of the resin sawing through the plates and hardened resin to define discrete encapsulated capacitors.
Time: 10