| Title: | Electrically conductive resin pastes and multilayer ceramic capacitors having a terminal electrode comprised of the same | ||
| Application Number: | 93112683 | Application Date: | 1993.11.04 |
| Publication Number: | 1091854 | Publication Date: | 1994.09.07 |
| Approval Pub. Date: | 1998.05.13 | Granted Pub. Date: | 1998.05.13 |
| International Classifi-cation: | H01B1/22;H01G4/12;H01G4/232 | ||
| Applicant(s) Name: | E. I. Du Pont De Nemours and Company | Address: | |
| Inventor(s) Name: | Akira Inaba;Takayuki Oba | ||
| Attorney & Agent: | ZHANG ZHENGQUAN | ||
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Abstract: |
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| Disclosed is an electrically conductive resin paste for use in the formation of a terminal electrode for a multilayer ceramic chip capacitor with no need of a high temperature firing and a multilayer ceramic chip capacitor formed thereon. The resin paste comprises an admixture of an electrically conductive filler consisting of a noble metal powder, a resin binder, and a curing agent dispersed in an organic medium, the resin binder comprising a mixture of at least two resins of an epoxy resin and a thermosetting or thermoplastic resin and the weight ratio of the noble metal powder to the thermosetting resin being about 100:5 to 100:45. | |||
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| Time: | 10 | ||
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