Title: Thick film circuit formulation
Application Number: 85101180 Application Date: 1985.04.01
Publication Number: 1007276 Publication Date: 1987.01.17
Approval Pub. Date: Granted Pub. Date: 1989.01.04
International Classifi-cation: C03C3/07,H01C7/00,H01L27/01
Applicant(s) Name: Hitachi Ltd. Address:
Inventor(s) Name: Ogiwara Akira, Suzuki Hideo
Attorney & Agent: XIAO CHUNJING ZHANG WEIMIN
Abstract:
     The circuit, especially a mixed integrated circuit has very good adhesion property with sintered ceramic substrate, and the variation of electric resistivity or electric conductivity with time is very little. It is manufactured by using organic adhesive, conductive powder and glass powder. The glass powder contains (by weight) 10-50% Pbo, 20-60% ZnO and at least one of the two materials, ie B2O3 and SiO2. The boride should be less than 40% and the SiO2 should be less than 30%.
Time: 17
<- Previous Patent:Arrester capable of blocking carr...   |  Next Patent:Centrifugal compressor ->