Title: Method for integration of resistors in chemically deposited conductor networks
Application Number: 86106985 Application Date: 1986.09.11
Publication Number: 1020038 Publication Date: 1988.08.03
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01C17/06;H05K3/00
Applicant(s) Name: Schering AG (DE) Postfach 65 03 11, D-1000 Berlin Address:
Inventor(s) Name: Detlef Tenbrink;Martin Bock
Attorney & Agent: WANG YIPING
Abstract:
    The invention relates to an integration process for high-reliability and small thick-layer resistors in conductor networks which are produced using chemical or electro-chemical processes, characterised in that, on a circuit carrier with a conductor network, after the screen printing process, resistor pastes are printed and burnt in or hardened, or in that a circuit carrier is initially printed with the resistor pattern and the associated contact spots after an adhesion-improving pretreatment, and in that, after the burning in or hardening of the pastes, a fully-additive conductor path construction is carried out by means of selective, chemical metal deposition.
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