Title: Hermetically sealed electronic component
Application Number: 86106280 Application Date: 1986.09.23
Publication Number: 1010704 Publication Date: 1987.04.22
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01C1/02;H01L23/02;H05K13/00
Applicant(s) Name: John Fluke Mfg., Co., Inc. Address:
Inventor(s) Name: I. Macit Gurol
Attorney & Agent: XIAO CHUNJING DU YOUWEN
Abstract:
    A cermic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.
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