Title: Linear thick-film negative temp. coefficient thermistor
Application Number: 86108011 Application Date: 1986.11.15
Publication Number: 1015683 Publication Date: 1988.01.06
Approval Pub. Date: Granted Pub. Date: 1990.01.17
International Classifi-cation: H01C7/00,H01C7/04
Applicant(s) Name: Hongming Raido Equipment Factory Address:
Inventor(s) Name:
Attorney & Agent: RONG LAN
Abstract:
     Print two thermosensitive resistors with different characteristics in the two surfaces of a ceramic chip respectively and cascade the two thermosensitive resistor to form a negative temp. coefficient thermosensitive resistor. The paste materials used to print the first thermosensitive resistor are Co Mn Ni, RuO2 and power Ag conducting glass and adhesive glass. Among the conducting glass. There is 15-25% of RuO2. The weight of powdered Ag is 10-30% of that of RuO2. The ratio of the two resistance R25/R50=1.22 -2%. The complement of the two thermosensitive resistors forms a thermosensitive resistor with a nonlinear alias of no bigger than -1% compared with a linear equation.
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