| Title: | Method for mfg. platinum film of temp. sensor | ||
| Application Number: | 88105605 | Application Date: | 1988.11.16 |
| Publication Number: | 1042793 | Publication Date: | 1990.06.06 |
| Approval Pub. Date: | Granted Pub. Date: | 1992.06.10 | |
| International Classifi-cation: | C23C14/35,C23C14/40,G01K7/18,H01C7/00,H01C7/12 | ||
| Applicant(s) Name: | Shanghai Metallogical Inst., Chinese Academy of Sc | Address: | |
| Inventor(s) Name: | Li Shengqiang | ||
| Attorney & Agent: | SHEN DEXIN | ||
|
|
|
||
Abstract: |
|||
| It adopts the high-frequency sputtering or the magnetic-control sputtering and uses platinum as target. Under the argon-oxygen atmosphere the polished ceramic substrate is sputtered, where in the oxygen-argon volume ratio of the argon-oxygen mixed gas of the sputtering atmosphere the oxygen is 5-30%, and the rest is argon. The sputtered platinum film is exposed to the treatment under stepped temperature rise in air and is insulated at 1000-1200 deg.c. The resistance-temperature coefficient (TCR) of the temperature sensor made of this platinum film is up to (3.850 minus or plus 10)X10 to the power -3 ohm/ohm deg.c, and therefore it is an economic and practical method for industrial production of the platinum film resistance temperature sensors. | |||
|
|
|||
| Time: | 15 | ||
<- Previous Patent:Film resistance temp. sensor and ...
| Next Patent:Preparation of the material for m... ->
|
|||