Title: High molecular polymer thermistor material with positive temperature coefficient
Application Number: 93110575 Application Date: 1993.02.20
Publication Number: 1077566 Publication Date: 1993.10.20
Approval Pub. Date: Granted Pub. Date: 1995.02.15
International Classifi-cation: H01C7/02
Applicant(s) Name: Yuan Xiaohui Address: 210018
Inventor(s) Name: Gao Bingxiang, Li Jianqing
Attorney & Agent: SHEN LIAN WANG RUI
Abstract:
     The PTC thermistor material uses high molecular polymer as base material added with electric conductive filler 20-30% (volume) and thermal conductive filler 5-22% (volume) which are homogenuously diffused in the polymer and the optimum volume ratio of the electric conductive filler and the thermal conductive filler is 60:40 to 75:25. The materials are mixed in a banburying mixer, the temperature is controlled at 70-90 deg.C above the melting point of the polymer, then through heat processing to form the required shape.
Time: 9
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