Title: Polymer thick film resistor compositions
Application Number: 93116967 Application Date: 1993.09.15
Publication Number: 1085686 Publication Date: 1994.04.20
Approval Pub. Date: 1997.08.20 Granted Pub. Date: 1997.08.20
International Classifi-cation: H01B1/14;H01B1/20;H01B1/22;H01B1/24;H01C7/00;H01C17/06
Applicant(s) Name: E.I. Du Pont de Nemours and Co. Address:
Inventor(s) Name: Jay Robert Dorfman
Attorney & Agent: LIN YUNHE
Abstract:
    A polymer thick film resistor composition is disclosed which comprises: (1) finely divided particles of a conductive metal having a surface area of 0.3 to 3.0 m2/g; (2) finely divided particulate material having a surface area greater than 100 m2/g; (3) a thermoplastic resin; dissolved in (4) an organic solvent having a volatility rating of 10,000 to 50,000; wherein the composition is substantially curable within 2.5 minutes by heating to a temperature of 135 DEG C., and further wherein the volume ratio of particulate material to resin is at least 3.5, and the weight ratio of solvent to resin is 3 to 5.
Time: 11
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