Title: Electroconductive glue materials directly weldable, flexible and being capable of adhering
Application Number: 86100151 Application Date: 1986.01.11
Publication Number: 1012249 Publication Date: 1987.07.22
Approval Pub. Date: Granted Pub. Date: 1991.07.17
International Classifi-cation: H01B1/02,H01B1/22,H05K1/09
Applicant(s) Name: Electric Materials Corp. of America Address:
Inventor(s) Name: Frank Wayne Martin
Attorney & Agent: LUAN BENSHENG
Abstract:
     This invention offers a few electroconductive glue materials. They are weldable, flexible and can be directly adhered onto substrate. These glue materials only consist of flake silver powder and the binder of resin system which includes chloroethene vinyl acetate copolymer, epoxy resin and epoxi-hardener. This invention also presents a method for producing these glue materials. Another embodiment of this invention is to add the glue materials directly onto the substrate. This is performed by directly adhering the former on the later. Soon after solidification, the electroconductive glue materials represent excelent conductivity, weldability, flexibility as well as good direct adhesiveness to substrate.
Time: 15