Title: Method of producing wafer
Application Number: 86107119 Application Date: 1986.10.21
Publication Number: 1010274 Publication Date: 1987.04.09
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B28D5/00;C30B33/00
Applicant(s) Name: Mitsubishi Kinzoku Kabushiki Kaisha (JP) Tokyo Jap Address:
Inventor(s) Name: Yuichi Saitou
Attorney & Agent: QI ZENGDU
Abstract:
    There is disclosed a method of providing an elongated stock; producing a wafer comprising the steps of processing one end face of an elongated stock to form a first flat surface; cutting through one end portion of the stock transversely by a cutter to provide a slice of a predetermined thickness having opposite side faces defined respectively by the first flat surface and a cut surface subjected to the cutting; and processing the cut surface of the slice to form a second flat surface, using the first flat surface as a reference surface, thereby providing the wafer.
Time: 5