Title: Electrolytic removal of plated copper and nickel layer from iron base articles in ammonium bicarbonate solution
Application Number: 87104298 Application Date: 1987.06.16
Publication Number: 1030102 Publication Date: 1989.01.04
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C25F5/00
Applicant(s) Name: Guangdong Polytechnical College Address:
Inventor(s) Name: Huang Sangxin, Lin Jiangming
Attorney & Agent: ZHAO YI HE SHUZHEN
Abstract:
     This invention relates to the deplating technology in the electroplating business. It is aimed at solving the main difficult problem of removing the plated nickel, copper layer on iron base materials. Nickel layer to be removed is not easily dissolved, while the iron base material not to be removed easily dissolved. According to chemical characteristics of nickel, copper and iron and related theories of electrochemistry the technology of this invention utilizes ammonium bicarbonbate (NH3-CO2-H2O system) solution for electrolytic deplating of nickel and copper layer. Test runs show that expected effects can be achieved. This process overcomes various disadvantages of other deplating process, such as toxicity, short sevice life of electrolyte solution, high cost of production difficulties in recovering metals, and corrosion of the iron base material, etc. Besides it has many advantage such as requiring only simple equipment, no pollution to environment, extensive applicability, etc.
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