Title: Etching device
Application Number: 01104686 Application Date: 1996.10.17
Publication Number: 1321797 Publication Date: 2001.11.14
Approval Pub. Date: 2005.08.03 Granted Pub. Date: 2005.08.03
International Classifi-cation: C25F3/12;C25F7/00;H01L21/306;H01L21/465;H01L31/18
Applicant(s) Name: Canon K.K. Address:
Inventor(s) Name: Ichise Hirofumi;Sawayama Ippei;Hasebe Akio
Attorney & Agent: wang yonggang
Abstract:
    The present invention provides a method and device for etching an object , comprising a step of immersing said object in an electrolyte solution such that said object serves as a negative electrode; a step of arranging a counter electrode having a pattern corresponding to a desired etching pattern to be formed at said portion to be etched of said object in said electrolyte solution so as to maintain a predetermined interval between said counter electrode and said object, and a step of applying a direct current or a pulse current between said object and said counter electrode to etch said portion to be etched of said object into a pattern corresponding to said pattern of said counter electrode. An etching apparatus is described comprising a substrate holding segment , an electrolytic bath, a locomotive mechanism for moving the substrate holding segment, and a counter electrode holding segment for holding a counter electrode. The counter electrode is positioned to oppose the substrate held on the substrate holding segment.
Time: 5