Title: Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
Application Number: 98809607 Application Date: 1998.01.06
Publication Number: 1291243 Publication Date: 2001.04.11
Approval Pub. Date: 2004.09.29 Granted Pub. Date: 2004.09.29
International Classifi-cation: C25D5/08;C25D7/12;C25D17/00;C25D21/06;C25F1/00;C25F7/00
Applicant(s) Name: Semitool, Inc. Address:
Inventor(s) Name: Lyndon W. Graham;Kyle Hanson;Thomas L. Ritzdorf
Attorney & Agent: li hui
Abstract:
    A system for electroplating a semiconductor wafer comprises a first electrode in electrical contact with the semiconductor wafer and a second electrode. The first electrode and the semiconductor wafer form a cathode. The second electrode forms an anode. A reaction container defines a reaction chamber. An auxiliary electrode is disposed exterior to the reaction chamber and positioned for contact with plating solution exiting the reaction chamber. A power supply system is connected to supply plating power to the first and second electrodes during electroplating of the semiconductor wafer and is further connected to render the first electrode an anode and the auxiliary electrode a cathode during cleaning of the first electrode.
Time: 6