Title: Apparatus for electropolishing metal interconnections on semiconductor devices
Application Number: 200410004837 Application Date: 1999.07.08
Publication Number: 1523647 Publication Date: 2004.08.25
Approval Pub. Date: 2007.03.21 Granted Pub. Date: 2007.03.21
International Classifi-cation: H01L21/321;C25F3/16
Applicant(s) Name: ACM Research Inc Address:
Inventor(s) Name: Wang Hui
Attorney & Agent: wang yonggang
Abstract:
    An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.
Time: 4