Title: Methods and appts. for electropolishing metal intennections on semiconductor devices
Application Number: 99808421 Application Date: 1999.07.08
Publication Number: 1318207 Publication Date: 2001.10.17
Approval Pub. Date: 2004.04.21 Granted Pub. Date: 2004.04.21
International Classifi-cation: C25F3/22;H01L21/321
Applicant(s) Name: ACM Research Inc Address:
Inventor(s) Name: Wang Hui
Attorney & Agent: wang yonggang
Abstract:
    An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.
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