Title: Copper plating with ethylene glycol as complexing agent
Application Number: 85103672 Application Date: 1985.05.09
Publication Number: 1004689 Publication Date: 1986.11.05
Approval Pub. Date: Granted Pub. Date: 1987.07.01
International Classifi-cation: C25D3/38
Applicant(s) Name: Fu Xiren Address:
Inventor(s) Name:
Attorney & Agent:
Abstract:
     This invention presents a new cyanide free copper plating bath solution in which copper can be directly and firmly electrodeposited on iron or steel parts. The plating bath solution consists of a copper (Cu#) compound, e.g. CuC12 or CuSo4 and a complexing agent, such as eihylene glycol and caustic soda, They form a stable complexion system. The electrodeposited copper is firmly bound on the iron or steel substrate and the so called dip plating process may be eleminated. The advantage of the method of this invention consists in that there is no envionmental pollution problem of toxicity inherent in the conventional cyanide plaling process, nor any low bonding strength problem often found in other eyanide free plating processes. It is suitable for preplating of cu on iron and other cu-plating process.
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