Title: A technology for plating thick silver on high nickel-base alloy-steel
Application Number: 86102549 Application Date: 1986.10.29
Publication Number: 1018273 Publication Date: 1988.05.11
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C25D3/46,C25D5/36
Applicant(s) Name: Shanghai Polytechnic Univ. Address:
Inventor(s) Name: Luo Wenyan
Attorney & Agent: FENG PEIYING ZHANG XUSEN
Abstract:
     This invention is a technology for plating thick silver on high nickel-base alloy-steel, and belongs to the field of chemical industry. Its objective is to create conditions for producing large-zize "O" shape rings economically in the future and makes use of the existing rare noble metals materials in our country in the choices of metal plating. The technology chooses palladium and other rare noble metals as transition layer, and uses new technologies of positive activation and nickel foreplating. The preformance of the transition layer is better than copper transition layer. The appearance of the "O" shape ring of lg 1030.5 and lg 962.5 mm plated in accordance with this technology possesses white brightness, without phenomena of loose stains and forming tumours, and so on. All platting liquids used in the technology don't add any additives.
Time: 7
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