Title: Mask method for local silver-plating
Application Number: 87107696 Application Date: 1987.06.13
Publication Number: 1019837 Publication Date: 1988.07.27
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C25D5/02
Applicant(s) Name: Beijing Switch Factory Address:
Inventor(s) Name: Bai Lianyuan, Li Huichang
Attorney & Agent: ZHANG QINGTAI
Abstract:
     The present invention relates to a local surface silver-plating method for conducting components in electrical products. A special insulated mask is covered onto the component to be plated to mask or expose the surface as requested. Durring electroplating, because of the masking effect of the mask, the electrical deposit on the covered surface is very slow. When the plating on the required surface reaches the preset thickness, the plating on the non-plating surface is at most 10% of that. Before the component is taken out from the trough, first the mask is taken off, then the whole component is plated again for 3-5 minutes, so as to obtain the required plating thickness distribution in every part and the identical appearance on whole surface. The said method may save silver by 50-80% and the work efficiency is doubled compared with that of the current surface insulating method.
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