| Title: | Dissolution of metals utilizing tungsten-diol complexes 2 | ||
| Application Number: | 85101736 | Application Date: | 1985.04.01 |
| Publication Number: | 1008102 | Publication Date: | 1987.01.31 |
| Approval Pub. Date: | Granted Pub. Date: | ||
| International Classifi-cation: | C23F1/18,H05K3/06 | ||
| Applicant(s) Name: | Plastic Specialties | Address: | |
| Inventor(s) Name: | |||
| Attorney & Agent: | LUO CAIXI | ||
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Abstract: |
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| A solution containing H2SO4, H2O2 and catalytic amount of tungsten-diol complex is used to accelerate the rate of dissolving metals. This invention relates to the dissolution of metal in aqueous etching solution containing H2SO4-H2O2, and especially relates to the recipes of a novel etching solution with high dissolving ability to metals. This method is mainly applied on the etching of copper in the production of printed circuit board. | |||
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| Time: | 6 | ||
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