| Title: | Passivating process for surface of copper and its alloy | ||
| Application Number: | 86103910 | Application Date: | 1986.06.02 |
| Publication Number: | 1015289 | Publication Date: | 1987.12.16 |
| Approval Pub. Date: | Granted Pub. Date: | 1993.05.05 | |
| International Classifi-cation: | C23C22/73,C23C22/78,C23F3/06 | ||
| Applicant(s) Name: | MetalCorrosion and Protection Inst. of CAS | Address: | |
| Inventor(s) Name: | |||
| Attorney & Agent: | TA XIANZHI | ||
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Abstract: |
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| This invention is characterized by: (1) dilute chromic acid treatment is performed after bright acid dipping (polishing) procedure; (2) the concn. of oxalic acid polishing solution is doubled; besides, a phosphoric acid polishing solution which offers very high polishing efficiency is provided; (3) passivation film-forming (treatment) is the combined treatment by a mixt. of benzotriazole and polyvinyl alcohal. It is a passivating technology providing ideal protective films with neither polluting environment nor impairing operator's health. | |||
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| Time: | 6 | ||
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