Title: Preparation technique of surface protective film by ligand polymerization of nitrogenous heterocycle and metallic copper
Application Number: 89105394 Application Date: 1989.02.01
Publication Number: 1044670 Publication Date: 1990.08.15
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C09D5/08,C23F15/00
Applicant(s) Name: Nanjing Univ. Address:
Inventor(s) Name: Ding Jianfu, Huang Xueying
Attorney & Agent: WU SHIHUA
Abstract:
     The preparation technique of surface protective film by use of coordination polymerizatin of nitrogenous heterocycle and metallic copper belongs to the field of metallic corrosion prevention. The treatment liquid of the copper is compounded by use of nitrogenous heterocycle and aqueous alcohol, and then the accelerator is added, so that the polymerized protective film is formed on the surface of the metallic copper. The film structure is compact, firm, therefore it can be alkali-proof, acid-proof, and can resist the corrosion of ammoniacal etching liquor of copper, and its weldability is not influenced. The said technique is applicable to the corrosion prevention of copper and copper alloy and the manufacture and protection of printed wiring board.
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