Title: Recovery method for copper from waste etching solution
Application Number: 91100122 Application Date: 1991.01.04
Publication Number: 1062930 Publication Date: 1992.07.22
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B22F9/24,C22B3/46,C23F1/46
Applicant(s) Name: Jing Huande Address: 116031
Inventor(s) Name:
Attorney & Agent: HU LIANSHENG
Abstract:
     This invention relates to a method for recovering Cu from waste alkaline and acidic etching solutions. Said two kinds of etching solution are mixed and hydrochloric acid is used to regulate its pH value to 1-4. After dilution with water to make the concentration of copper chloride 30-100g/l, iron filings are used for replacement reaction to obtain copper filings whose copper content is over 95% and whose granularity is over 320 meshes. Such copper filings may be directly used to produce cuprous oxide.
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