Title: Forming method for anti-corrosion layer
Application Number: 200510096698 Application Date: 2005.08.30
Publication Number: 1924096 Publication Date: 2007.03.07
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C23D5/02;C04B35/01
Applicant(s) Name: Taiji Industry Equipment Co., Ltd. Address:
Inventor(s) Name:
Attorney & Agent: wangyu shuang panpei kun
Abstract:
    The invention discloses a corrosion resistance layer forming method to prevent lead-free tin solder corrosively, which comprises the following steps: providing an object (tin groove, external object of tin groove or temperature-sensing bar) with metal surface; supplying a ceramic material with oxide, nitride, carbide, boride or compound of oxide, nitride, carbide and boride; adhering ceramic material on the metal surface of object; generating bond connection between ceramic material and object.
Time: 10