Title: Aqueous alkaline both for chemical deposition of copper, nickerl, cobalt and their alloys
Application Number: 85101242 Application Date: 1985.04.01
Publication Number: 1007185 Publication Date: 1987.01.17
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C23C18/34,C23C18/40
Applicant(s) Name: Schering A.G. Address:
Inventor(s) Name:
Attorney & Agent: GU BAIDI LI LUOYING
Abstract:
     The invention relates an alkaline liquid bath to make adhesive chemical deposit layer of highly pure Cu, Ni, Co and their alloys. The bath liquid contains the above-mentioned metals or their alloys, reducing agent, wetting agent, PH adjusting agent, stabilizing agent, inhibitor and complexing agent, the last agent is characterized by containing compound of polyhydric alcohol and/or biuret. The invention also relates how to use the bath to produce printing circuit plate.
Time: 6
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