Title: Ion plating technique by high energy level magnetron sputtering
Application Number: 85102600 Application Date: 1985.04.01
Publication Number: 1003315 Publication Date: 1986.09.17
Approval Pub. Date: Granted Pub. Date: 1988.09.28
International Classifi-cation: C23C14/22
Applicant(s) Name: Dalian Polytechnical College Address:
Inventor(s) Name: Chen Baoqing, Wang Yukui, Zhu Yingchen
Attorney & Agent: XIU DEJIN
Abstract:
     The invention is implemented by using a magnetron sputtering ion plating device with a high negative voltage power connected to the work piece. The coating technology causes the plated film to have a transition layer in which the elements of the target material (i.e. coating material) and those of the base material may coexist, compound phade of the elements of the target material and those of the basis material and a solid solution phase may appear in the plated film. With the multiglow high energy level magnetron sputtering ion plating technique, the transition layer of coating is further developed, and deposition of multi-layer coating, multi-element plating and reactive plated film can be obtained by the technique of this invention. This technique is capable of satisfying the demands of various kinds of surface properties required. It is featured by energy-saving, no public hazard, etc..
Time: 5