Title: Combined magnetic-controlled sputter target and its plating method
Application Number: 85105634 Application Date: 1985.07.25
Publication Number: 1007881 Publication Date: 1987.01.28
Approval Pub. Date: Granted Pub. Date: 1990.01.24
International Classifi-cation: C23C14/34
Applicant(s) Name: Qinghua Univ. Address:
Inventor(s) Name:
Attorney & Agent: ZHANG SHANYU
Abstract:
     At least two electromagnetic elements of regulatable megnetic field strength are put together to make this equipment. These elements use the same cathode target plate and sputter power source. The field strength on the target surface of each element may be adjusted through each electromagnet, so the power of each element may be adjusted resp. Each element may be used dependently or independently. When different target materials are used for different elements. The alloy film of different metal may be plated and the component of the film of alloy may be continuously regulated by this sputter device.
Time: 3