Title: Process for reductive plating on alloy honeycomb substrate
Application Number: 85107171 Application Date: 1985.09.29
Publication Number: 1000628 Publication Date: 1986.05.10
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B01J37/02,C23C18/44
Applicant(s) Name: Xu Jinhang, Bi Tong Address:
Inventor(s) Name: Bi Tong
Attorney & Agent: LOU GENJI ZHANG HUI
Abstract:
     The process for reductive plating is adopted in the invention. The substrate is pretreated by unoiling, coarsing, thermal activating, etc. The plating solution is composed of plating metal of palladium and platinium (or their soluble salts), PH buffer of ammonium chloride and reductant of hydrogen sulfite of sodium. Comparied with those of classical single replacement plating and the improved couple replacement plating, this process has advantages since it has a fight and homogeneous plating and is of high chemical and thermal steability, good catalytic activity, etc.
Time: 2