Title: Electrolytic copper foil for printed circuit board and its producing method
Application Number: 97102226 Application Date: 1997.01.14
Publication Number: 1163318 Publication Date: 1997.10.29
Approval Pub. Date: 2001.04.11 Granted Pub. Date: 2001.04.11
International Classifi-cation: C22F1/08;H05K3/38
Applicant(s) Name: Mitsui Mining Address:
Inventor(s) Name: Takaki Hidetai;Hirasawa Hiroshi;Oshima Ichiei
Attorney & Agent: FAN BENGUO
Abstract:
    The present invention provides an electrolytic copper foil adequate for superfine pattern applications having an excellent etching characteristic, high-frequency characteristic and excellent insulation reliability at the time of forming wiring patterns. Characterized in that, the surface roughness of the rough surface side before a matte treatment of this electrolytic copper foil is less than 1.5 mu m and the surface roughness after the matte treatment on the rough surface is 1.5 to 2.0 mu m. This invention further provides a method of manufacturing such an electrolytic copper foil, characterized in that, the surface roughness before the matte treatment is adjusted to less than 1.5 mu m by polishing the electrolytic copper foil and the rough surface side of the electrolytic copper foil with buff and the surface roughness is adjusted to 1.5 to 2.0 mu m by subjecting the rough surface side to the matte treatment.
Time: 5