Title: Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
Application Number: 97192237 Application Date: 1997.12.04
Publication Number: 1211287 Publication Date: 1999.03.17
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B23K20/00;B23K31/02;B32B15/00;B32B15/10;B32B15/20;C21D1/09;C22F1/08;C23C14/34
Applicant(s) Name: Johnson Matthey Electronics, Inc. Address:
Inventor(s) Name: Anthony F. Beier;Janine K. Kardokus;Susan D. Sroth
Attorney & Agent: wang dazuo
Abstract:
    Described is a method for producing a diffusion bonded sputtering target assembly which is thermally treated to precipitation harden the backing plate without compromising the diffusion bond integrity. The method includes heat treating and quenching to alloy solution and artificially age the backing plate material after diffusion bonding to a target. Thermal treatment of the diffusion bonded sputtering target assembly includes quenching by partial-immersion in a quenchant and is performed after diffusion bonding and allows for various tempers in the backing plate.
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