Title: Mold releasing composition
Application Number: 87102964 Application Date: 1987.03.28
Publication Number: 1015111 Publication Date: 1987.12.09
Approval Pub. Date: 1991.06.05 Granted Pub. Date: 1991.06.05
International Classifi-cation: B29C33/58;C08L83/04;C10M107/50;D06M15/643
Applicant(s) Name: Daikin Industries Ltd. Address:
Inventor(s) Name: Iwuo Hisemoto;Maseoshi Singjou;et al
Attorney & Agent: YANG JIUCHANG
Abstract:
    This invention provides a mold release composition comprising (l) a compound or a polymer having at least one of perfluoroalkyl groups having 4 to 20 carbon atoms and perfluoroalkenyl groups having 4 to 20 carbon atoms, and (2) a ladder polymer of organosilsesquioxane.
Time: 4
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