Title: Thermal interface material
Application Number: 200410027981 Application Date: 2004.07.02
Publication Number: 1715361 Publication Date: 2006.01.04
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C09K5/18
Applicant(s) Name: Hongfujin Precision Industry (Shenzhen) Co., Ltd. Address: 518109
Inventor(s) Name: Jian Yangchang
Attorney & Agent:
Abstract:
     The thermal interface material includes gap filling fluid and metal particle dispersed in the fluid and capable of reacting with air. The particle capable of reacting with air is nanometer level particle. Inside the thermal interface material, the metal particle reacts with air in the interval of the heat source and heat dissipating assembly to reduce or even eliminate interval to lower heat resistance and raise heat conducting performance. The reaction product with high heat conducting performance may further improve the heat conducting performance of the thermal interface material.
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