Title: Copper foil adhesion agent for copper-foil-covering laminated paper plate
Application Number: 86100670 Application Date: 1986.01.21
Publication Number: 1008079 Publication Date: 1987.01.31
Approval Pub. Date: Granted Pub. Date: 1989.07.05
International Classifi-cation: C01B33/00,C09J3/14,C09J3/16,C09J7/04
Applicant(s) Name: Huzhou Insulant Factory, Zhejiang Prov. Address:
Inventor(s) Name:
Attorney & Agent: QI BINBIN
Abstract:
     This invention is a copper foil adhesion agent, suitable to clothing-, particularly suitable to non-clothing copper-foil-covering laminated paper plate. It consists of polyvinyl acetals resin and phenolic aldehyde condensation resin. It is characterized by adding microsilicon powder which has been activated by complex hydrosilicon coupling agent. The components polyvinil acetals resin and phenolic aldehyde condensation resin are 100 by weight, while the added active microsilicon powder, whose average particle size is greater than 300 mesh, is 10-300 by weight. The copper foil adhesion agent prepared according to this invention improves the anti-water ability, peeling-off strength, electro-performance and chemical-corrosion resistance of the non-clothing copper-foil-covering laminated paper plate. It is easy to operate and reduces the cost.
Time: 3
<- Previous Patent:Textile bonding with plastic film   |  Next Patent:Preparation of soya-oil dregs-bas... ->