Title: Structural adhesive formulation
Application Number: 86106944 Application Date: 1986.10.07
Publication Number: 1011484 Publication Date: 1987.06.10
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C08F291/00;C08K5/34;C08L9/00;C08L33/14;C09J3/14
Applicant(s) Name: Lord Corp. (US) 2000 West Grandview Blvd Erie, Sta Address:
Inventor(s) Name: Denis Jerome Zalucha
Attorney & Agent: LI LUOYING
Abstract:
    Two-pack adhesive systems which are curable by free radical polymerization at room temperatures are disclosed. The adhesives bond a variety of substrates, including metals and plastics. The adhesives comprise a first part containing free radical polymerizable unsaturated monomer and free radical source and a second part comprising free radical polymerizable unsaturated monomer and an activator compound for the free radical source. The activator compound is a bicyclic amidine, with 1,8-diaza-bicyclo [5,4,0] undec-7-ene being especially preferred. The use of cupric salts enhances polymerization rate.
Time: 9