Title: Rapid curing, thermally stable adhesive
Application Number: 87102640 Application Date: 1987.04.09
Publication Number: 1014378 Publication Date: 1987.11.04
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C08K5/00;C08L63/04;C09J3/14
Applicant(s) Name: Stauffer Chemical Co. (US) Dobbs Ferry, New York 1 Address:
Inventor(s) Name: Anthony Leonard Disalvo;Jagadish Chandra Goswami;R
Attorney & Agent: REN ZONGHUA LIN BAINAN
Abstract:
    A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) an epoxy resin, (b) a soluble polyimide resin, (c) a reactive solvent; and (d) an alkenylphenol crosslinker which preferably contains polyhydroxy and polyalkenyl substituents. Optionally, the adhesive may also contain a conductive material.
Time: 17
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