Title: Adhesive for heat-insulating board and its mfg. method
Application Number: 87105060 Application Date: 1987.08.13
Publication Number: 1031541 Publication Date: 1989.03.08
Approval Pub. Date: Granted Pub. Date: 1991.01.09
International Classifi-cation: C08G63/12,C09J167/00
Applicant(s) Name: Liaoyang Petro-Chemical Fibres Corp., China Petro- Address:
Inventor(s) Name:
Attorney & Agent: WANG YING
Abstract:
     The present invention uses the residue of para-benzene dicarboxylic dimethyl ester and polyester production as main raw materials which are mixed with polyhydric alcohol to carry out ester exchange and polycondensation reaction under the action of catalyst and, accompanying with stirring, heated to 210-250 deg.C in temp. under the pressure of 600-750 mmHg. As the softening point of the resin reaches to 95-125 deg.C, the resultant is discharged, cooled down and solidified, and further, the solid is broken into pwder. Its index comes up to natioinal standard, it may be substitued for the bakelite currently used. Utilizing the residue for making the adhesive of heat-insulating board solves not only the utilization of waste and the reduction of environmental pollution, but also the problems of the conspicuous lack of raw materials and the high production cost in heat-insulating board adhesive industry.
Time: 12
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