| Title: | Chemical mechanical polishing slurry for metal layers | ||
| Application Number: | 95196473 | Application Date: | 1995.09.01 |
| Publication Number: | 1166805 | Publication Date: | 1997.12.03 |
| Approval Pub. Date: | 2001.10.31 | Granted Pub. Date: | 2001.10.31 |
| International Classifi-cation: | B24B1/00;C09G1/00 | ||
| Applicant(s) Name: | Cabot Corp. | Address: | |
| Inventor(s) Name: | Matthew Heville;David J. Fluck;Michael A. Lucarell | ||
| Attorney & Agent: | WU XIAONAN | ||
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Abstract: |
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| A slurry for use in chemical mechanical polishing of a metal layer comprising high purity fine metal oxide particles uniformly dispersed in a stable aqueous medium. | |||
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| Time: | 5 | ||
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