Title: Surface-treating process for conductive copper powder
Application Number: 90101099 Application Date: 1990.03.06
Publication Number: 1049622 Publication Date: 1991.03.06
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: B22F1/02,C08K3/08,C09C1/62
Applicant(s) Name: Beijing Printing Technology Inst. Address: 100009
Inventor(s) Name: Li Jiang, Pan Xijin
Attorney & Agent: ZHU LIGUANG
Abstract:
     A method of surface treatment for conducting copper powder comprises degreasing the copper powder, eliminating oxidized film by using acid, then washing the powder to neutral, covering a layer of silver on surface of the copper powder by conventional chemical process, again washing with filtered water to neutral, treating the copper powder with phthalic ester coupling agent. After drying, the multi-layered conducting copper powder is prepd.
Time: 3