Title: Thermosetting at moderate temp., high strength epoxy adhesive
Application Number: 85100135 Application Date: 1985.04.01
Publication Number: 1002308 Publication Date: 1986.08.13
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C08L63/10,C09J3/16
Applicant(s) Name: Qinghua Univ. Address:
Inventor(s) Name: Lin Xiuying, Sun Yishi, Wang Siqun
Attorney & Agent: WANG BING
Abstract:
     The present modified epoxy adhesive mainly comprises of: (1) 100 parts (wt.) of a thermosetting mixed resin of two or more epoxy resins, each molecule of which has at least two epoxy rings as terminal groups,preferably at least one of epoxy resin is solid and the other is liquid at 25 deg.C. (2) 5-30 pts of liquid butyronitrile rubber of average mol. wt.3000-4000, its vinylcyanide content is 20-30%,and average 1.7 carboxyl groups as terminal groups of each molecule. (3) Small amount of potential solidification agent which is stable at 25 deg.C. but solidifying at 120 deg.C, and promoter as well as some thixological agents. This adhesive can be used without mixing with other components, and can be made into adhesive film, adhesive liquid or adhesive stick.
Time: 9
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