Title: Formulaion of epoxy resin
Application Number: 85101494 Application Date: 1985.04.01
Publication Number: 1006701 Publication Date: 1987.01.10
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C08G59/42,C08L63/00
Applicant(s) Name: Mitsubishi Electric Co., Ltd. Address:
Inventor(s) Name:
Attorney & Agent: LIU YUANJIN LUO YINGMING
Abstract:
     The formulation contains the following compositions: the admixture (A) composed of 100 weight parts of polybasic carboxylic anhydride and 10-70 weight parts of compound whose molecule contains at least two phenol groups, the eqoxy resin whose molecule contains at least two epoxy groups, the catalyzer and the mineral powder used for filler.
Time: 7
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