Title: Epoxy resin composite
Application Number: 85102717 Application Date: 1985.04.11
Publication Number: 1003896 Publication Date: 1986.10.08
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: C08G59/40,C08K5/07,C08K5/54,C08L63/00
Applicant(s) Name: Hubei Chemical Inst., Wuhan Address:
Inventor(s) Name: Peng Xiansheng, Zhang Shicun
Attorney & Agent:
Abstract:
     The invention relates to a composite which is composed of following components: (1) epoxy resin containing at least two epoxy groups in the molecule, (2) ootential curing system consisting of (a) phenolic resin (b) organic silicon compound in which at least one hydroxyl group is bonded to the silicon atom (c) complexes of acetylacetone with common metal ions. This epoxy resin composite has a good stability during storage and a high reaction activity at room temperature. It cures rapidly at temperatures above 100 seg.c. The cured resin has good ther,al resostance, good mechanical and electrical properties and can be used as immersion paint, adhesives, laminating and cast resin.
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