Title: Epoxy resin composition
Application Number: 85107222 Application Date: 1985.09.24
Publication Number: 1000706 Publication Date: 1986.05.10
Approval Pub. Date: 1989.02.22 Granted Pub. Date: 1989.02.22
International Classifi-cation: C08G59/42;C08G59/62;C08L63/00
Applicant(s) Name: Mitsubishi Denki K.K. Address:
Inventor(s) Name: Fumio Nogami;Kazuo Yasuda;Masaru Tsuchihashi;Toshi
Attorney & Agent: WANG SUNJIA
Abstract:
    An epoxy resin composition comprises an epoxy resin having an epoxy equivalent of at most 200; a condensation mixture(A) of a polybasic carboxylic acid anhydride, a bisphenol A having the formula(I) and a polyhydric alcohol, as a curing agent; and an inorganic powder, as a filler.
Time: 6