Title: Composition of heat-resistant polymer resin
Application Number: 85107439 Application Date: 1985.10.09
Publication Number: 1010397 Publication Date: 1987.04.15
Approval Pub. Date: Granted Pub. Date: 1990.08.01
International Classifi-cation: C08G59/20
Applicant(s) Name: Gehle-Etherks Co. Address:
Inventor(s) Name:
Attorney & Agent: LIU YUANJIN LUO HONG
Abstract:
     This invention involves a composition of polymer resin produced from (A) and (B). (A) is at least one kind of compounds which contains more than one groups of 1-oxa-3-aza-1,2,3,4-tetrahydro naphthyl in each molecule on average. (B) is at least one kind of alicyclic epoxides which contains at least two epoxy groups, and at least one group among them being a part of the cycle. The mole ratio of (B) to (A) is about 0.2-2.
Time: 9