Title: Epoxy moulded plastic forming technology used for sealing electronic device
Application Number: 86100232 Application Date: 1986.01.03
Publication Number: 1003073 Publication Date: 1986.09.10
Approval Pub. Date: Granted Pub. Date: 1988.10.26
International Classifi-cation: C08G59/40,C08G59/62,C08L63/00,H01L23/30
Applicant(s) Name: Fudan Univ. Address:
Inventor(s) Name: 220 Handan Road
Attorney & Agent: CHEN WEIKANG
Abstract:
     This technology adopt complex salt of organic acid anhydride with imidazole derivative and imidazole derivatives as a compound accelerating agent. The compound accelerating agent can be prepared easily and stored stably and has the feature of nonpoison and odourless. To seal electronic devices with the epoxy mold plastic made by this technology, high seal quality reliability and good seal craft can result.
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