Title: Composition epoxy resin
Application Number: 86102325 Application Date: 1986.04.10
Publication Number: 1003897 Publication Date: 1986.10.08
Approval Pub. Date: 1989.09.27 Granted Pub. Date: 1989.09.27
International Classifi-cation: C08G59/42;C08L63/00
Applicant(s) Name: Mitsubishi Electric Corp. Address:
Inventor(s) Name: Ando Toshiji;Anta Wao;Bando Yoshifumi;Dobashi Sugu
Attorney & Agent: LIU YUANJIN
Abstract:
    A novel epoxy resin composition is prepared by first mixing 100 parts by weight of an epoxy resin having an epoxy equivalent of no more than 200 with 0.5-10 parts by weight of a phenoxy resin to form a uniform mixture, then blending the mixture with a curing agent (i.e., a condensation product of a polybasic carboxylic acid and bisphenol A) and an inorganic filler. The epoxy resin composition has a suitable degree of rigidity and softness within the molecular chain without sacrificing its resistance to heat or thermal shock and will not cause precipitation of any portion of the filler in the resin composition. This resin composition is useful in the making of cast insulators employed in electric machines.
Time: 8
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