Title: Element mounting method, IC card and producing method therefor
Application Number: 99102061 Application Date: 1999.03.03
Publication Number: 1234567 Publication Date: 1999.11.10
Approval Pub. Date: 2007.05.02 Granted Pub. Date: 2007.05.02
International Classifi-cation: G06K19/07;B42D15/10
Applicant(s) Name: Matsushita Electric Industries Co., Ltd. Address:
Inventor(s) Name: Okuaki Massa;Akikuki Shoshi;Muraue Shinshi
Attorney & Agent: sun jingguo
Abstract:
    The present invention provides a method for mounting parts, and an IC card and its manufacturing method, capable of reducing the number of steps, increasing productivity, reducing in costs, and miniaturizing the chip. For this purpose, a first electrode(7a)of the IC chip(4)for processing signals received from a coil(3)is connected to an internal end(3b)of a coil pattern(2)formed on a first substrate(1a), and an external end(3a)of the coil pattern(2)and a second electrode(7b)of the IC chip(4)are connected via a jumper wiring means(8).
Time: 12