Title: Dynamic cellular automaton method for simulation of photoresist three dimensional etching process
Application Number: 200410065791 Application Date: 2004.11.19
Publication Number: 1605940 Publication Date: 2005.04.13
Approval Pub. Date: 2006.08.16 Granted Pub. Date: 2006.08.16
International Classifi-cation: H01L21/00,G06G7/58
Applicant(s) Name: Southeast University Address: 210096
Inventor(s) Name: Zhou Zaifa, Huang Qing'an
Attorney & Agent: ye liansheng
Abstract:
     The invention discloses a dynamic cellular automaton method for simulation of photoresist three dimensional etching process by employing a three-dimensional Mole neighboring region, when calculating the etching process for an element cell, the effect of 6 adjacent element cells and 12 opposite adjacent element cells are considered while neglecting the effect of the 8 dot adjacent element cells to the etching process, the process comprises instituting rules to determine the surface element cells during simulation process, considering the remaining time of the time step after an element cell is completely etched within a time step, adding the remaining time to the next time step for etching the adjacent element cell.
Time: 9
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