Title: Semiconductor integrated circuit device, electronic part mounting plate and layout design method thereof
Application Number: 200610092679 Application Date: 2006.06.13
Publication Number: 1881584 Publication Date: 2006.12.20
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: H01L27/02,H01L23/50,H01L21/82,G05F1/46
Applicant(s) Name: Matsushita Electric Industrial Co., Ltd. Address:
Inventor(s) Name:
Attorney & Agent: di wankui huang xiaolin
Abstract:
     A circuit configuration is adopted which supplies an internal power supply voltage from outside and inside of a semiconductor chip 1. The internal power supply voltage from the outside is supplied through an internal power supply pad 20, whereas the internal power supply voltage from the inside is supplied through a regulator 110. The regulator 110 is arranged in an area giving a remarkable level reduction due to the voltage drop in an internal power supply wiring 21 a, thereby supplementing shortage in the internal power supply voltage from the internal power supply pad 20.
Time: 8