Title: Temperature controlled hybrid assembly
Application Number: 87107389 Application Date: 1987.12.08
Publication Number: 1019159 Publication Date: 1988.06.22
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G05D23/19;H05B3/20
Applicant(s) Name: John Fluke Mfg. Co., Inc. (US) 6920 Seaway Bouleva Address:
Inventor(s) Name: Larry E. Eccleston
Attorney & Agent: CAO JIHONG XU XINGEN
Abstract:
    A hybrid circuit structure includes an electrical circuit and a heating circuit therefor, both mounted on a single substrate. Valuable substrate space is saved by mounting the electrical circuit components on one surface of the substrate and the heating circuit elements on the opposite surface. A temperature control circuit is included, preferably mounted on the same surface as the electrical circuit components. Precision resistors for gain control and other functions may be provided on a separate substrate which may be mounted directly to the single substrate or to a separator therebetween. The precision resistors are in thermal contact with the temperature controlled heating circuit, thereby further increasing the stability of the circuit.
Time: 6
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