Title: A process and apparatus for improving and controlling the curing of natural and synthetic moldable compounds
Application Number: 200580007726 Application Date: 2005.03.11
Publication Number: 1950768 Publication Date: 2007.04.18
Approval Pub. Date: Granted Pub. Date:
International Classifi-cation: G05B19/18;G05B15/02;G05B13/02;G06F19/00;B29C39/00;B29C45/00;G06G7/66;G01F1/00;G01F7/00;G01F17/00;G01
Applicant(s) Name: Signature Control Systems Inc. Address:
Inventor(s) Name: Schneider Scott;Magill Richard
Attorney & Agent: yangsheng beng yanggong mei
Abstract:
    A process for curing a moldable compound under a plurality of curing conditions by: (1) obtaining time dependent data streams of dielectric or impedance values from a plurality of sensors distributed within a curing mold, wherein the moldable compound is a dialectric for each of the sensors; (2) determining impedance related measurements from the data streams for the plurality of sensors; (3) determining predictive and/or corrective curing actions for enhancing the curing process using the impedance related measurements for the plurality of sensors; and (4) controlling the mass production curing of parts to obtain cured parts having one or more desired properties.
Time: 8